| 摘要 |
PURPOSE:To prevent the corrosion of metal wirings and deterioration of polyimide by forming photosensitive polyimide resin precursor composition layer on a ladder silicone resin layer on a board, forming a through hole, and then forming an upper layer interconnection layer on a polyimide resin layer generated by heat treating. CONSTITUTION:A ceramic board 1 formed with a first interconnection layer 2 of a predetermined pattern is rotatably coated with ladder silicone resin varnish, and then heated to form a ladder silicone resin layer 3. The layer 3 is rotatably coated with photosensitive polyimide resin precursor varnish, and then heated to form a photosensitive polyimide resin precursor film 4. With a mask 5 it is emitted with an ultraviolet ray, then the film 4 is developed and the layer 3 is etched. Then, it is heat-treated to obtain a polyimide resin film 7 formed with a through hole 6, and a second interconnection layer 8 is formed on the resin film 7, thereby preventing corrosion, deterioration. |
