发明名称 MULTILAYER PRINTED BOARD
摘要 <p>PURPOSE:To effectively utilize a low-cost reinforcing board. CONSTITUTION:The multilayer printed board P1 comprises a reinforcing board 100 formed with a wiring pattern 110 on its surface, one flexible board 200 to be laminated on a surface of the board 100, and a wiring pattern 230 also formed on the board 200, wherein the patterns 110, 230 of both the boards 100, 200 are conducted via a through hole 240 of the board 200. Paper phenol or thick PET resin is used for the board 100, and PET resin is used for the board 200.</p>
申请公布号 JPH07249872(A) 申请公布日期 1995.09.26
申请号 JP19940066754 申请日期 1994.03.09
申请人 HOSIDEN CORP 发明人 SAITO TAKASHI;NAKAGAWA HIROSHI
分类号 H05K1/02;H05K3/00;H05K3/40;H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K1/02
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