| 摘要 |
PURPOSE:To provide a method for manufacturing a semiconductor device which can prevent burr at the edge part at the rear surface side of a semiconductor chip easily and simply, regarding a semiconductor device manufacture by an aligner or laser beaming device. CONSTITUTION:A first half mirror 2 for separating light emitted from a light source part 1 into light advancing straightly through a main light path 7 and light advancing straightly through a first reflection light path 8 crossing the main light path 7 are provided. Further, a third half mirror 4 for reflecting the light advancing straight through the main light path 7 to a second reflection light path 10, a fourth half mirror 5 for reflecting the light advancing straight through the second reflection light path 10 toward a second exposure light path 11, and a detector 6 for detecting the deviation between light advancing straight through a first exposure light path 9 and light advancing straight through the second exposure light path 11 are provided. |
