发明名称 ELECTRONIC COMPONENT
摘要 PURPOSE:To realize a large man-hour reduction, shortening of a production period and hence a short time delivery and a decrease in cost by sealing a board formed with a functional part, a terminal, etc., which must be contained in nonsuppression or non-contact manner with a resin film or a conductor- coating resin film, thereby forming an air gap in the functional part, and high- frequency-shielding it. CONSTITUTION:A board 1 to be formed with a functional part, a terminal, etc., which must be contained in non-suppression or non-contact manner is sealed with the functional part by a conductor-coating resin film 2 via a space.
申请公布号 JPH07249877(A) 申请公布日期 1995.09.26
申请号 JP19940040051 申请日期 1994.03.10
申请人 MURATA MFG CO LTD 发明人 NISHIMURA HITOSHI;FUJIHASHI TAKASHI
分类号 H05K5/00;H01L21/00;H01L23/04;H01L23/31;H03H3/08;H03H9/02;H03H9/25;(IPC1-7):H05K5/00 主分类号 H05K5/00
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