发明名称 LEAD FRAME FORMING MATERIAL
摘要 <p>PURPOSE:To produce a large quantity of a lead frame having uniform quality by making a photosensitive material to contain a diazo salt photosensitive resin and a lipophilic polymer compound insoluble in water and soluble in alkaline water. CONSTITUTION:A substrate made of copper, copper alloy, or nickel alloy is coated with a photosensitive material on both faces, it is dried, wound, or laminated to obtain a lead frame forming material. A diazo salt photosensitive resin and a lipophilic polymer compound insoluble in water and soluble in alkaline water are contained in the photosensitive material; or a light-dimerization type photosensitive composition is contained; or a negative type resist composition constituted of a resin insoluble in water and soluble in alkaline water, a compound generating acid when active light or radioactive rays are radiated, and a compound having at least one group capable of ross-linking by the action of acid is used for the photosensitive material. The working process is simplified, and the dust sticking problem and excessive loss can be avoided.</p>
申请公布号 JPH07248617(A) 申请公布日期 1995.09.26
申请号 JP19940042672 申请日期 1994.03.14
申请人 FUJI PHOTO FILM CO LTD 发明人 NARUSE YASUTO;KAMIYA KIYOSHI;UESUGI AKIO;KAKEI TSUTOMU;MOROHOSHI KOICHI
分类号 G03F7/004;G03F7/00;G03F7/021;G03F7/115;H01L21/48;H05K3/06;H05K3/20;(IPC1-7):G03F7/004 主分类号 G03F7/004
代理机构 代理人
主权项
地址