发明名称 |
RESIN COATED INSULATION BONDING WIRE |
摘要 |
PURPOSE:To provide an insulation bonding wire which has good bonding property, is free from coating damage during bonding and has good insulation property even if wires come into mutual contact in a resin mold process. CONSTITUTION:A resin coating insulation bonding wire has a heat reduction amount of 85% or more at a temperature of 1100 deg.C in atmosphere and is coated with resin whose tensile strength at a temperature of 180 deg.C is 300kgf/cm<2> or more. As coating resin which satisfies characteristics, at least one kind of polyparabanic acid resin or polyarylate resin can be selected. |
申请公布号 |
JPH07249649(A) |
申请公布日期 |
1995.09.26 |
申请号 |
JP19940040059 |
申请日期 |
1994.03.10 |
申请人 |
NIPPON STEEL CORP |
发明人 |
KONDO HIROYUKI;NARUKI SHINYA;NITTA NORIO;TATSUMI KOHEI |
分类号 |
H01L21/60;H01B3/30;H01B3/42;H01L23/49 |
主分类号 |
H01L21/60 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|