| 摘要 |
PURPOSE:To provide a semiconductor device incorporating a heat plate in which the semiconductor device is prevented from warping. CONSTITUTION:A semiconductor chip 1 is mounted on a heat plate 20 and connected through a thin metal wire 4 with the inner lead 3a of a lead frame 3. They are then sealed with resin except the outer lead 3b of the lead frame 3 to produce a semiconductor device wherein the heat plate 20 is formed by coupling two heat conductive discs 21, 22 through a coupling member. |
