| 摘要 |
PURPOSE:To obtain a material for heat dissipation board having good plastic workability and thermal conductivity in which the anisotropy is suppressed as low as possible in the thermal conductivity and the coefficient of thermal expansion by braiding a thin metal wire of molybdenum or tungsten into a mesh and then impregnating the mesh with an impregnant of copper, copper- tungsten or copper-molybdenum and integrating them. CONSTITUTION:The material 5 for heat dissipation board is produced by impregnating a metal mesh 2 of W with an impregnant 3 of Cu, Cu-W or Cu-Mo and integrating. A thin wire of Mo or W is braided into a metal mesh 2 which is placed on a heat-resistant board for impregnation and the impregnant 3 of Cu or Cu-W or Cu-Mo, containing preferable quantity of Cu, is mounted. It is then heated at the melting point of Cu or above in a nonoxidative atmosphere so that Cu in the impregnant 3 is fused to spread into the metal mesh 2 thus forming a composite 5. Subsequently, the composite 5 is subjected to necessary rolling for enhancing adhesion between the impregnant 3 and the metal mesh 2. Finally, it is subject to machining, e.g. grinding, to obtain a product 5.
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