| 摘要 |
PURPOSE:To prevent short circuit of lead and cracking of package while enhancing the mountability by arranging the outer connecting parts of connecting lead in zigzag on the opposite sides of the frame body part on the bottom part. CONSTITUTION:The outer connecting parts 18-1, 18-2 of first and second connecting leads 13-1, 13-2 are extending inward from the opposite sides of the bottom part 19 of frame body part 12 and arranged in zigzag on the opposite sides. Consequently, the lead connecting parts 17-1, 17-2 are arranged at same pitch as that P of the outer lead 16 of a semiconductor device 11. Since the outer connecting parts 18-1, 18-2 are arranged in zigzag, they can be spaced apart sufficiently from each other and thereby the arranging pitch can be increased substantially. |
