| 摘要 |
<p>PURPOSE: To provide a semiconductor assembly for a three-dimensional integrated circuit package, the whole capacity of which can be suppressed as far as possible, while controlling manufacturing cost. CONSTITUTION: When a plurality of the semiconductor assemblies with a plurality of edge recess sections 114, which are formed on one sides of at least the semiconductor assemblies 110 and from which a plurality of leads 111 are exposed, constitute a three-dimensional integrated circuit package, the edge recess section of a certain semiconductor assembly accepts a plurality of the leads 111 of the semiconductor assemblies placed at the upper sections of the edge recess section of the semiconductor assembly for electrical connection. The semiconductor assemblies 110 have upper and lower recess sections 112, 113 in top faces and undersides, and spaces for accepting the heat sinks 121 or capacitor plates are formed of one upper recess section 112 of the semiconductor assemblies and the lower recess section 113 of the semiconductor assemblies placed at the upper sections of the semiconductor assemblies.</p> |
