| 摘要 |
PURPOSE:To realize highly efficient production of uniform product with high gradability and high reliability at the resin encapsulation molding of electronic part. CONSTITUTION:At the mold clamping of both the upper and lower molds 102, molten resin material R is charged in a runner 105 under the state that gates 107 are shut off by switching means 112. After that, under the state that the gates 107 are communicated with one another by the switching means 112, the molten resin material R in the runner 105 is secondarily applied with a secondary pressure means 111. Thus, the molten resin material R is simultaneously and respectively poured and charged in respective cavities 106, resulting in making the resin pouring pressure, resin pouring timing and resin pouring speed of the respective cavities 106 constant or setting the resin molding conditions in the respective cavities 106 equal to one another. |
