| 摘要 |
<p>PURPOSE:To manufacture an electronic device easily at low cost by forming a hollow airtight state in a mold resin without requiring any special component for hermetic sealing. CONSTITUTION:The electronic device 1 comprises a board 5 having a surface formed with a circuit wiring 50 and mounting electronic elements 6, 7, 8, a lead frame 2 for setting the board, and a resin molding the board and the lead frame. The island part 3 of the lead frame comprises a flat peripheral part 31 and a part 32 protruding downward and the board is jointed, on the rear side, to the peripheral part of the island part. A first electronic element 12 is disposed in a hollow part 4 defined by the rear surface of the board and the protruding part of the island. The first electronic element is connected through wirings 14, 53, 51 with the circuit wiring on the surface of the board which is then connected through a wire 9 with the bonding land 21 on the foot 20 of the lead frame. Subsequently, the electronic elements arranged on the surface of the board are resin molded along with the lead frame.</p> |
