| 摘要 |
PURPOSE:To provide a composite lead frame in which short circuit between adjacent leads is prevented even when the lead frame has a high pin count and a fine lead pitch while enhancing reliability in the bonding of the lead frame to the substrate and the circuit and to eliminates the need of conducting all circuits again at the time of electroplating of Au. CONSTITUTION:In the composite leads frame, a ground layer 4, a power supply layer 3 and a signal layer 6 are formed on a metal substrate 2 and the inner lead 1 of the lead frame is bonded onto the metal substrate 2 through an adhesive 7. The ground layer 4, the power supply layer 3 and the signal layer 6, formed on the metal substrate 2, are connected electrically with the inner lead 1 through plating. |
