发明名称 MULTILAYER PRINTED BOARD WITH METAL CORE
摘要 PURPOSE:To connect both a power source and a ground layer to a metal core in a multilayer board and to reduce in thickness the board. CONSTITUTION:Metal cores 2, 2a of a multilayer printed circuit board with metal core provided in an inner layer of a multilayer board 1 are electrically insulated from one another and arranged in two layers so that one is used as a power source layer and the other is used as a ground layer. Outer surfaces of the cores 2, 2a are coated with insulating resin layers 5 to be insulated by utilizing the structure, and a blind hole 11 is formed between outer conductor patterns 9a and 9b of the two cores.
申请公布号 JPH07249876(A) 申请公布日期 1995.09.26
申请号 JP19940042755 申请日期 1994.03.14
申请人 OKI ELECTRIC IND CO LTD 发明人 KUBOTA TOMOYUKI
分类号 H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K3/46
代理机构 代理人
主权项
地址