Soldering appts. for mounting components on printed circuit boards

摘要

A soldering appts. for soldering from below the connecting pins of a component inserted in a printed circuit board, comprising a spot soldering nozzle (15) with an opening (16) for the introduction and passage of molten solder and a slot (17) extending downwards from the opening such that the connecting pins (13) can pass through from the side; a solder supply unit (18) supplying molten solder to the said opening of the spot soldering nozzle (15); a translation unit (14) for positioning the spot soldering nozzle relative to the printed circuit board (11), the movement of which is numerically controlled in accordance with the printed circuit board data. A number of variants are claimed.