发明名称 |
Modulares hermetisches Gehäuse. |
摘要 |
A hermetic module has a frame with an integral heat sink panel (20) extending thereacross between frame walls. High-density integrated circuit electronics (48, 50) are mounted on the heat sink panel (20) by hybrid assembly techniques. Covers (36, 38) are welded to the walls to achieve closure. A feedthrough (74) includes a connector block (84) extending through an opening (82) in a frame front bulkhead (76). The front bulkhead (76) is Kovar clad, and seal is achieved by means of a Kovar flexible seal (92) extending between the Kovar side of the front bulkhead (76) and a Kovar ring (86) on the connector block (84). <IMAGE> |
申请公布号 |
DE69112179(D1) |
申请公布日期 |
1995.09.21 |
申请号 |
DE1991612179 |
申请日期 |
1991.11.27 |
申请人 |
HUGHES AIRCRAFT CO., LOS ANGELES, CALIF., US |
发明人 |
RUNYAN, MICHAEL D., TORRANCE, CALIFORNIA 90504, US |
分类号 |
H01L25/18;H01L25/04;H01L25/065;H01L25/07;H01L25/16;H01R12/57;H01R12/70;H01R13/52;H05K5/00;(IPC1-7):H05K5/00;H01R9/09;H01R23/68 |
主分类号 |
H01L25/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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