Vorrichtung und Verfahren zur Bestückung von Leiterplatten mit elektronischen Bauelementen unter Verwendung von Führungskörpern

摘要

An apparatus for positioning circuit components such as flat package IC's at predetermined positions of a printed circuit board and a method therefor are disclosed. In the apparatus, a guide body is provided on the printed circuit board and a positioning member is installed on a retainer plate which holds one of the circuit components. The guide portion guides the positioning member to a point where the component coincides with the predetermined position.