Disclosed in this invention is a thermoplastic resin composition comprising a thermoplastic resin, a conductive inorganic filler and/or a non-conductive inorganic filler, and an adduct of an ethylene oxide with a saponified product of a copolymer of ethylene and a vinyl ester of a saturated carboxylic acid. The adduct of an alkylene oxide with a saponified product of a copolymer of ethylene and a vinyl ester of a carboxylic acid is an additive having excellent compatibility with the thermoplastic resin and useful for improving dispersibility of the inorganic filler.
