发明名称 Paste for closing holes in ceramic substrates.
摘要 <p>A ceramic filler (10) material suspended in an organic carrier forms a paste. The ceramic filler (10) material includes two components, namely a ceramic sealing material, preferably in powder form, having a melting temperature below the melting temperature of the ceramic substrate (12), and a ceramic stabilizing material, also preferably in powder form, having a melting temperature higher than that of the ceramic sealing material. The organic carrier may be selected from a wide range of slow drying lacquers, acetates, or other like materials capable of suspending the ceramic filler material to form a viscous slurry. &lt;IMAGE&gt;</p>
申请公布号 EP0672639(A1) 申请公布日期 1995.09.20
申请号 EP19950300240 申请日期 1995.01.16
申请人 HEWLETT-PACKARD COMPANY 发明人 CHRISTIANSEN, FRANK JOHN
分类号 C04B37/00;C04B35/653;H05K1/03;H05K3/00;H05K3/40;(IPC1-7):C04B37/02 主分类号 C04B37/00
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