发明名称
摘要 PURPOSE:To improve the product quality and soldering efficiency by providing the jig equipped with the opening part for loading a substrate and arranging the wall in the specified height respectively at the front side and both sides in the transfer direction as well. CONSTITUTION:The jig 100 for soldering is prepared and the opening part 14 only for loading a substrate 30 is formed at the center part thereof. The walls 12, 13 having the height more than the length of the conductor pin of the substrate 30 are arranged at the front side for the transfer direction and both sides on the lower side face of the opening part 14. The opening part 14 has the dimension capable of simultaneously supporting plural substrates 30, the substrate 30 is held by the end part of a transfer claw at its both sides and the soldering of a jetted molten solder is performed. The wall 12 forcibly removes the oxidized film on the solder surface, preventing the generation of an icicle, etc. and the wall 13 smoothes the flux feeding. Consequently both the product quality and soldering efficiency are improved.
申请公布号 JPH0785834(B2) 申请公布日期 1995.09.20
申请号 JP19860252370 申请日期 1986.10.23
申请人 发明人
分类号 B23K1/08;B23K3/08;H01L23/50;H05K3/34;(IPC1-7):B23K1/08 主分类号 B23K1/08
代理机构 代理人
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