Method of forming a thin film electronic device.

摘要

A thin film electronic package which utilizes a circuitized substrate (e.g., a printed circuit board) having a flexible film carrier (11) electrically coupled thereto. The film carrier includes a dielectric layer (25) (e.g., polyimide) with first and second circuit layers (23, 27) located on opposite sides thereof. These circuit layers are interconnected, electrically, through the dielectric. An electronic device (13) (e.g., semiconductor chip) is electrically connected to bridging portions of the conductive leads of the carrier's first circuit layer, which bridging portions extend across apertures (29) provided within the dielectric. A plurality of solder elements (19) are utilized to provide electrical connection between respective contact locations of the electronic device and respective bridging portions of the first layer's conductive leads. Further a method of forming electrical connections between a flexible film carrier and an electronic device is described. The method comprises the steps of aligning the film carrier relative to the device having a plurality of solder mounds located on an upper surface thereof. The film carrier is engaged such that bridging portions of conductive leads thereof physically contact these solder mounds. Hot gas is passed through a screen member to heat the bridging portions of the leads to cause these leads to in turn heat the solder mounds to cause the mounds to become molten, whereafter these leads and mounds are cooled to form the desired solder bonds.