发明名称 HIGH-DENSITY ELECTRICAL INTERCONNECT SYSTEM.
摘要 An electrical interconnect system includes an insulative substrate (503), and a plurality of groups (514) of electrically conductive contacts (500) arranged on the substrate (503). The contacts (500) are electrically isolated from one another, and the groups (514) are interleaved among one another in a nested configuration. The system also includes a plurality of receiving-type interconnect components (900) each for receiving one of the groups (514) of contacts (500) within that component. The nested configuration of the groups (514) of contacts (500) maintains the contacts in close proximity to one another and, at the same time, allows adequate clearance between the contacts (500) so that each group (514) may be received within one of the receiving-type interconnect components (900). <IMAGE>
申请公布号 EP0672309(A1) 申请公布日期 1995.09.20
申请号 EP19940901497 申请日期 1993.11.18
申请人 CRANE, STANFORD W., JR. 发明人 CRANE, STANFORD W., JR.
分类号 H01R13/11;H01R4/24;H01R12/50;H01R12/67;H01R12/71;H01R12/82;H01R13/02;H01R13/03;H01R13/04;H01R13/193;H01R13/26;H01R24/00;H01R24/60;H05K1/00 主分类号 H01R13/11
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