发明名称 Silicon alloys for electronic packaging
摘要 <p>A method of producing a silicon based alloy is described which comprises melting a silicon alloy containing greater than 50 wt. % silicon and preferably including aluminium. The melted alloy is then inert gas atomized to produce powder or a spray formed deposit in which the silicon forms a substantially continuous phase made up of fine, randomly oriented crystals in the microstructure. The alloy produced by the method has particularly useful application in electronics packaging materials and a typical example comprises an alloy of 70 wt. % silicon and 30 wt. % aluminium. Such an alloy is an engineering material which, for example, is machinable.</p>
申请公布号 GB9514777(D0) 申请公布日期 1995.09.20
申请号 GB19950014777 申请日期 1995.07.19
申请人 OSPREY METALS LIMITED 发明人
分类号 B22D23/00;B22F3/115;B22F9/08;C22C1/04;C22C1/10;C22C25/00;C22C28/00;C22C32/00;H01L23/06;H01L23/14;H01L23/373 主分类号 B22D23/00
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