| 摘要 |
The integrated circuit structure includes two conducting elements (42,60) separated by a gap (68) which is filled with gas. A conducting column (60) is mounted by its base above a semiconductor substrate (21). The first conductor is separated from the column (60) by a gap. An insulating material (34,36) defines a cavity which contains a part of the lateral surface of the column (60) and a part facing the surface of the conductor (42). Connections (66,62) are provided to both the column (60) and the conductor (42). |
