发明名称 |
Photopolymerisable liquid compositions for forming heat curable solid film adhesives |
摘要 |
A liquid composition which on exposure to actinic radiation polymerizes to form a heat-curable solid film adhesive, said composition comprising (A) a heat-curable phenol-aldehyde resol resin, (B) a photopolymerizable polyurethane or polyester having, on average, more than one polymerizable acrylic group per molecule, or a mixture of said polyurethane and said polyester, (C) a photopolymerization initiator for (B) and (D) a polyvinylacetal.
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申请公布号 |
US5451616(A) |
申请公布日期 |
1995.09.19 |
申请号 |
US19940284729 |
申请日期 |
1994.08.02 |
申请人 |
CIBA-GEIGY CORPORATION |
发明人 |
HADDON, MARGARET R.;SMITH, TERENCE J.;MANSFIELD, STUART |
分类号 |
C08F2/44;C08F2/48;C08F290/00;C08F299/02;C08L29/14;C08L61/06;C08L67/07;C08L75/04;C09J4/00;C09J4/02;C09J7/00;C09J129/14;C09J155/00;C09J157/00;C09J161/06;C09J163/02;C09J167/07;C09J171/10;C09J171/12;C09J173/00;C09J175/16;C09J179/08;C09K3/14;F16D69/04;(IPC1-7):C08F2/48 |
主分类号 |
C08F2/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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