发明名称 METHOD FOR MOUNTING ELECTRONIC COMPONENT PROVIDED WITH LEAD LEGS
摘要 PURPOSE:To easily fix a power semiconductor, etc., tentatively on a printed board without using an exclusive jig by using other electronic components such as resistor and capacitor, which are very common as peripheral electronic components, in place of an aligning member for a power semiconductor, etc. CONSTITUTION:For mounting an electronic component 3 provided with lead legs such as a power semiconductor, etc., on a printed board 1, other component 5 such as a resistor and capacitor is inserted into an auxiliary board 2, which is formed to be separated from the printed board for alignment, in place of an positioning member. The electronic component provided with lead legs is aligned by using the electronic component 5, the lead legs 4 are inserted into the printed board and after soldering the lead legs to the printed board, the auxiliary board is separated and removed.
申请公布号 JPH07245498(A) 申请公布日期 1995.09.19
申请号 JP19940058314 申请日期 1994.03.04
申请人 KENWOOD CORP 发明人 NAKAJIMA TSUNEHIRO
分类号 B23P21/00;H05K1/02;H05K1/18;H05K3/00;H05K3/30;H05K13/04 主分类号 B23P21/00
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