| 摘要 |
PURPOSE:To bring the polished surface of a wafer into almost parallel contact with abrasive cloth by fitting a wafer holding means in such a way as to close the opened face of a pressure vessel. CONSTITUTION:A lower surface table 80 is rotated, and a polishing solution is fed onto abrasive cloth 82 from a nozzle 79. An upper surface table 50 is moved downward while being rotated, and the polished surface of a wafer 51 is brought into contact with the abrasive cloth 82 to perform polishing for the specified time. Since a base holder fixing plate 52 with the wafer 51 fixed thereto is fitted to a pressure vessel 60 by a laminated plate 69 including a plate spring, the direction of the polished face is changed flexibly to a certain extent. Even in the case of the rotational center axis of the upper surface table member 50 being slightly shifted from the vertical direction, the polished surface of the wafer 51 can be almost parallelly brought into contact with the abrasive cloth 82. |
