发明名称 THIN SUBSTRATE AND METAL MOLD FOR MOLDING THIN SUBSTRATE
摘要 PURPOSE:To provide a thin substrate and metal mold for molding the thin substrate capable of preventing generation of flashes at outside edges and permitting smooth and sure execution of vapor deposition of metal in post-stages. CONSTITUTION:A resin is supplied into the cavity C for the thin substrate in a closed state of the molds and thereafter, the second mold body 21 is moved in a mold closing direction relative to the first mold body 20 having an inclined part 20a corresponding to a chamfered part 30a, by which the resin in the cavity C is compression molded.
申请公布号 JPH07243028(A) 申请公布日期 1995.09.19
申请号 JP19940035047 申请日期 1994.03.04
申请人 MITSUBISHI MATERIALS CORP 发明人 TAKEDA YOSHINOBU
分类号 B29C45/26;B29C45/56;B29L17/00;C23C14/18;C23C14/20;G11B7/24;G11B7/26 主分类号 B29C45/26
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