发明名称 SURFACE MODIFICATION METHOD FOR HEAT INSULATING FILM
摘要 PURPOSE:To perform surface modification capable of preventing the peeling of a heat insulating film composed of a ceramic layer formed. on a base material via a metallic binding layer. CONSTITUTION:A heat insulating film 3 (about 200-400mum thickness) composed of ceramics is formed on a base material 1 via a metallic binding layer 2 by means of atmospheric pressure plasma thermal spraying. A surface modified layer 7 (about 10-100mum thickness) composed of a dense film (<=1.0% porosity) is formed on the surface of the film 3 by means of low pressure plasma thermal spraying or PVD. Because this surface modified layer 7 is dense, the infiltration of high temp. gas 5 into the heat insulating film 3 during operation can be prevented.
申请公布号 JPH07243018(A) 申请公布日期 1995.09.19
申请号 JP19940036919 申请日期 1994.03.08
申请人 MITSUBISHI HEAVY IND LTD 发明人 KANIKAWA MASAYA;IKEDA TAKAO;KAWAI YUKIHIRO
分类号 C23C14/06;C23C4/10;C23C4/12;C23C14/08 主分类号 C23C14/06
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