发明名称 |
SURFACE MODIFICATION METHOD FOR HEAT INSULATING FILM |
摘要 |
PURPOSE:To perform surface modification capable of preventing the peeling of a heat insulating film composed of a ceramic layer formed. on a base material via a metallic binding layer. CONSTITUTION:A heat insulating film 3 (about 200-400mum thickness) composed of ceramics is formed on a base material 1 via a metallic binding layer 2 by means of atmospheric pressure plasma thermal spraying. A surface modified layer 7 (about 10-100mum thickness) composed of a dense film (<=1.0% porosity) is formed on the surface of the film 3 by means of low pressure plasma thermal spraying or PVD. Because this surface modified layer 7 is dense, the infiltration of high temp. gas 5 into the heat insulating film 3 during operation can be prevented. |
申请公布号 |
JPH07243018(A) |
申请公布日期 |
1995.09.19 |
申请号 |
JP19940036919 |
申请日期 |
1994.03.08 |
申请人 |
MITSUBISHI HEAVY IND LTD |
发明人 |
KANIKAWA MASAYA;IKEDA TAKAO;KAWAI YUKIHIRO |
分类号 |
C23C14/06;C23C4/10;C23C4/12;C23C14/08 |
主分类号 |
C23C14/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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