| 摘要 |
<p>PURPOSE:To obtain a resin compsn. developable with a dilute aq. solution of an alkali, excellent in sensitivity and capable of forming a cure product excellent in adhesion, soldering heat resistance, gold electroless plating resistance, etc., by using a specific unsatd. carboxylic acid resin. CONSTITUTION:A reaction product of an epoxy compd. having at least two epoxy groups per molecule with a compd. having at least two hydroxyl groups per molecule and one functional group, other than a hydroxyl group, reactive with an epoxy group and an unsatd. monocarboxylic acid is blended with an unsatd. polycarboxylic acid resin obtd. by reacting an org. polyisocyanate with a polybasic acid anhydride. The unsatd. polycarboxylic acid resin content of the resulting resin compsn. is pref. 10 to 80wt.%. A photopolymn. initiator is pref. used in the compsn., wherein a photosensitizer may also be used. Further, the use of 5-80wt.% diluent is pref. This compsn. is used as a resist ink compsn.</p> |
