| 摘要 |
PURPOSE: To provide a semiconductor test device having a DUT substrate connection part in which the re-constitution is simple, the electrical and mechanical reliability is excellent, the noise and cross-talk are low, and high density mixed digital and analog device to be tested is permitted. CONSTITUTION: A semiconductor device test device is provided with a circuit board 10 including a plurality of conductor paths having a signal path and a ground path, a first end part 14 comprising a conductor member which is directed to a first surface 15 of the circuit board 10 and arranged so as to be engaged with a contact 19 of a semiconductor device 21, an inside array comprising the conductor member, and a second end part 16 comprising a conductor member directed toward a second surface 17, and the conductor member is provided with an outside array to be electrically connected to the desired conductor path among a plurality of conductor paths, and a means to electrically connect a grounding block 18 to the ground pass. |
