发明名称 METHOD FOR PRESSING LEAD FRAME FOR ELECTRONIC PARTS
摘要 PURPOSE:To stabilize the jointing strength between a lead terminal and wires at the time of wire bonding by making the lower surface of the lead terminal flat and pressing a lead frame against a heater block body so that the flat section can be brought into contact with the heater block body. CONSTITUTION:The lower surface part of each lead terminal A2 corresponding to its upper surface part which is brought into contact with a pressing body 4 is formed in a flat part P from the front end of the terminal A2. Consequently, each lead terminal A2 can be stably pressed against a heater block body 1 so that the flat section P can be brought into contact with the heater block body 1 when the pressing body 4 is lowered towards the heater block body 1. Therefore, the bonding load applied at the time of wire bonding and ultrasonic welding conditions are almost fixed and, as a result, the joining strength between the lead terminal A2 and a wire can be stabilized.
申请公布号 JPH07245322(A) 申请公布日期 1995.09.19
申请号 JP19940033707 申请日期 1994.03.03
申请人 ROHM CO LTD 发明人 MASUTANI TOMOMICHI
分类号 H01L21/60 主分类号 H01L21/60
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