| 摘要 |
<p>PURPOSE:To provide an IC chip mounted multilayer printed circuit board with a high-density circuit pattern and its manufacturing method, by mounting an IC chip using a photo-via-hole formed at layer insulating layer while a plurality of circuit patterns are connected to each other. CONSTITUTION:A second circuit pattern 5 connected to a first circuit pattern 3 on a base substrate 2 is formed in a photo-via-hole (P). A solder past(SP) applied to the second circuit pattern 5 is solidified to form a first solder layer 8 in the photo-via-hole (P). Then, the first solder layer 8 is connected to a solder bump 11 of an IC chip 10 in a solder fusion step for fusing a second solder layer 9 in a way that the IC chip 10 is mounted on a multilayer printed circuit board 1.</p> |
