| 摘要 |
<p>PURPOSE:To provide a semiconductor chip mounting method which is used for mounting a semiconductor chip on a printed wiring board with a solder bump in between and by which the numb connecting pins can be increased by reducing the layout pitch of the pins and, at the same time, the heat radiating efficiency from the semiconductor chip can be improved. CONSTITUTION:A thin film connector is provided with two supporters 61 having conical holes 63 which are surrounded by slopes formed of a heat-resistance adhesive film and pass through the film and a plurality of conductive balls 62 which are made of solder or a conductive resin and have a diameter larger than that of the narrower port 64 of the holes 63. The supporters 61 are put together so that the larger ports 65 of their holes 63 can be faced to each other, with the balls 62 being held in the spaces formed of the holes 63. Then the supporters 61 are tentatively jointed to each other so that the balls 62 can be held between the supporters 61.</p> |
