| 摘要 |
PURPOSE:To facilitate the mount and to reduce the cost by connecting a semiconductor integrated circuit to a coplaner wiring pattern via a conductive bump. CONSTITUTION:The hybrid integrated circuit 10 is provided with semiconductor integrated circuits 14, 15 with a solder bump 13 formed therein and each of the semiconductor integrated circuits 14,15 is soldered to one side of a printed circuit board 11 by using the solder bump 13. Furthermore, a chip component 16 and a terminal 12 are also soldered to the same one-side of the printed circuit board 11. Then the semiconductor integrated circuits 14, 15 and the chip component 16 are covered and protected by a ceramic-made cap 17. Since the semiconductor integrated circuits 14,15 are soldered to one side of the printed circuit board by using the solder bump 13 and the chip component 16 and the terminal 12 are soldered to the same one-side of the printed circuit board 11, the structure is simplified and since the terminal 12 is provided, they are easily mounted on other printed circuit board. |
