EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR SEALING,申请号JP19940034308-传众专利搜索

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发明名称	EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR SEALING
摘要
申请公布号	JPH07242731(A)	申请公布日期	1995.09.19
申请号	JP19940034308	申请日期	1994.03.04
申请人	SUMITOMO BAKELITE CO LTD	发明人	TAKASU NOBUTAKA
分类号	C08L63/00;C08G59/18;C08G59/20;C08G59/24;C08G59/62;H01L23/29;H01L23/31;(IPC1-7):C08G59/24	主分类号	C08L63/00
代理机构		代理人
主权项
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