发明名称 INDUCTION HEATING MOLD
摘要 PURPOSE:To ensure reliable crosslinking on the surface of a molded article by mixing powder of a piezo-electric material with a fluid thermosetting resin having a specific dielectric dissipation factor value, and using a mold made by thermosetting and molding the fluid thermosetting resin, with respect to a mold wherein a rubber material is crosslinked and crossl-inking-bonded by using an induction heating apparatus. CONSTITUTION:An induction heating mold 1 has a mold part 2 (2A, 2B) and a pair of electrodes 3A, 3B disposed on the outer portions thereof, and a rubber material 4 is injected into a cavity in the mold part 2. In this case, as a material of the mold part 2, resin is used, which is a thermosetting resin such as an epoxy resin, a phenolic resin, an imide resin, etc., whose dielectric dissipation factor value is at least 1X10<-2> and which has heat resistance of a crosslinking temperature or higher of a heat-generating material permitting rubber and the like to be crosslinked and crosslinking-bonded. Further, powder of a piezo-electric material comprising metals of a titanic acid is mixed with this resin, and the fluid thus prepared, whose viscosity is at most 1X10<6> centipoises, is injected into the mold, and the fluid is thermost, thereby obtaining a desired induction heating mold.
申请公布号 JPH07241853(A) 申请公布日期 1995.09.19
申请号 JP19940036648 申请日期 1994.03.08
申请人 KINUGAWA RUBBER IND CO LTD 发明人 KAMEYAMA KEITARO
分类号 B29C33/08;B29C33/02;B29C33/38;B29C35/12;B29K21/00;B29K105/24;(IPC1-7):B29C33/08 主分类号 B29C33/08
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