| 摘要 |
PURPOSE:To provide a wire bonding jig which can eliminate improper bonding even when a machined lead frame has metallic projections, such as burrs, etc. CONSTITUTION:In a wire bonding jig which is used at the time of electrically connecting the inner leads 1 of a lead frame to the electrodes 4 of a semiconductor integrated circuit 3 mounted on an island 2, a groove 6 is provided so that the front end sections of the inner leads 1 can float. |
