首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
EPOXY RESIN COMPOSITION AND SEALED SEMICONDUCTOR DEVICE
摘要
申请公布号
JPH07242729(A)
申请公布日期
1995.09.19
申请号
JP19940059963
申请日期
1994.03.05
申请人
TOSHIBA CHEM CORP
发明人
IBUKI KOICHI
分类号
C08G59/20;H01L23/29;H01L23/31;(IPC1-7):C08G59/20
主分类号
C08G59/20
代理机构
代理人
主权项
地址
您可能感兴趣的专利
Methods for recycling mRNA for linear cRNA amplification
Acridone derivatives as labels for fluorescence detection of target materials
Genomic profiling of regulatory factor binding sites
High throughput method and system for screening candidate compounds for activity against target ion channels
CDMA receiver, and path management method and path management program thereof
Extensible object previewer in a shell browser
Smart card printing
Continuing professional education management system
Binaural compression system
Automatic process monitoring system for associating an equipment identification and a data collection operation and method of use thereof
Thermal fixing device and image forming apparatus
Adaptive feedback canceller
Locking unit of a three-plate injection-molding machine
Method and apparatus for preventing and recovering from TLB corruption by soft error
Multi-threaded processor and method of multi-threaded processing
Semiconductor memory device and method for writing data into flash memory
Method for fabricating single crystal silicon film
Portable entertainment system
Thin film deposition reactor
Wafer protection system