发明名称 Lead-frame forming material.
摘要 <p>Disclosed are i) a lead-frame forming material which contains a light-sensitive material comprising (1) a diazo salt light-sensitive resin and (2) a water-insoluble but alkaline water-soluble lipophilic high molecular weight compound, ii) a lead-frame forming material which contains a light-sensitive material comprising a photodimeric light-sensitive composition, and iii) a lead-frame forming material which contains a light-sensitive material comprising (1) a water-insoluble but alkaline water-soluble resin, (2) a compound capable of generating an acid by irradiation with active rays or radiant rays, and (3) a compound containing at least one crosslinkable group by the action of the acid.</p>
申请公布号 EP0672951(A2) 申请公布日期 1995.09.20
申请号 EP19950103602 申请日期 1995.03.13
申请人 FUJI PHOTO FILM CO., LTD. 发明人 NARUSE, YASUHITO;KAMITANI, KIYOSHI;UESUGI, AKIO;KAKEI, TSUTOMU;MOROHOSHI, GOUICHI, C/O FUJI-HUNT ELECTRONICS
分类号 G03F7/004;G03F7/00;G03F7/021;G03F7/115;H01L21/48;H05K3/06;H05K3/20;(IPC1-7):G03F7/016 主分类号 G03F7/004
代理机构 代理人
主权项
地址