| 摘要 |
<p>A film removing device for removing a film existing on the surface of a structure by a laser beam wherein positions to be irradiated are scanned while carrying out complete film removing by monitoring removing conditions by a monitoring device (30), while portions to be irradiated are controlled by a controlling device (50), whereby automatic film removing operations can be performed relative to various types of structures. It is possible to remove films completely since film removing conditions are monitored by the monitoring device (30).</p> |
