FABRICATION MULTILAYER COMBINED RIGID/FLEX PRINTED CIRCUIT BOARD

摘要

A multilayer rigid flex printed circuit board, wherein the board laminate comprises a double-sided basestock composite, formed by laminating two conducting sheets (12 and 14) to an insulating layer, said insulator layer containing a flexible core (20), a second insulator layer (24 and 26) affixed to each side of the basestock, said insulator having a cutout region proximate to the flexible core of the basestock composite, a flexible layer (28 and 30) affixed to said cutout regions with an adhesive, wherein said flexible layer contacts the conducting layers and abuts and overlaps a portion of the second insulator layer such that upon stacking of the board laminate a hollow region (32) is produced as between the stacked laminate sections.