发明名称
摘要 A leadframe for an integrated circuit includes a set of individual leads temporarily connected in an array; each lead having an exterior portion shaped in a standard form and an interior portion shaped to form a standard array of contacts and to have the same spring constant for deflections perpendicular to the plane of the leadframe.
申请公布号 JPH0785499(B2) 申请公布日期 1995.09.13
申请号 JP19850501511 申请日期 1985.03.19
申请人 发明人
分类号 H01L23/48;H01L23/495;H01L23/50 主分类号 H01L23/48
代理机构 代理人
主权项
地址