发明名称 TEST ASSEMBLY OF INTEGRATED CIRCUIT, ELECTRICAL CONDUCTIVITY BRIDGE DEVICE AND TESTING METHOD OF INTEGRATED CIRCUIT
摘要 <p>PURPOSE: To provide a circuit testing assembly which can be used in a broad extent IC packages, by installing a conductive bridge means electrically connecting a lead of an IC package, and a conductive part of a base for testing, or the like. CONSTITUTION: The circuit testing assembly 10 comprises a conductive bridge means 20 for electrically bringing a lead 18 of an IC package 14 and a base board 40 for testing into contact with each other. The bridge means 20 is formed by four compressible bridge parts 22, 24, 26, 28. Each bridge part 22, 24, 26, 28 comprises plural parallel conductive wires 30 buried in an insulating member 32. The bridge means 20 is accomodated in a frame-shaped locator means 50, and the electric contact of the lead 18 of the package 14, and the base board 40 is performed by the bridge means 20. That is, the bridge parts 22, 24, 26, 28 are respectively installed at the holding parts 52, 54, 56, 58 formed around the locator means 50.</p>
申请公布号 JPH07239363(A) 申请公布日期 1995.09.12
申请号 JP19950015556 申请日期 1995.01.04
申请人 HEWLETT PACKARD CO <HP> 发明人 KENESU DABURIYU JIYONSON
分类号 G01R31/26;G01R1/04;H01L21/66;H01R12/57;H01R13/24;(IPC1-7):G01R31/26 主分类号 G01R31/26
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