POLISHING DEVICE FOR OUTER PERIPHERY OF WAFER

摘要

PURPOSE:To improve the stability and quickness of polishing by winding a tape round the outer periphery of a rotary drum, and moving the tape relatively to the outer periphery of the wafer through the rotation of winding reel for abutting the new part of the tape on the outer periphery of the wafer. CONSTITUTION:After a tape T drawn out of a drawing out reel is spirally wound on the outer periphery of the rotary drum 32 of a polishing machine 6a, (6b), the tape T is set so as to roll it round a winding reel. A bearing 14 having a rubber member 15 which is plated on its outside in a circumferential direction is provided along the outer periphery of the rotary drum 32 to give a cushioning function between the tape T and a wafer and moreover to enlarge a contact area. The tape T is formed by sticking and fixing fixed abrasive grains on the surface of a substrate. When the wafer is polished, the tape T is also moved in a peripheral direction by a winding reel motor 12 with the rotation of the rotary drum 32 made by its motor 11. A plurality of polishing machines 6a, 6b are arranged at fixed spaces along the outer periphery of the wafer.