| 摘要 |
PURPOSE:To improve manufacturing yield and reliability of a multilayer printed wiring board providing a means for evaluating the insertion mistake and error when constituting layers without increasing a manufacturing process before the lamination and a manufacturing method. CONSTITUTION:Holes 1a-4a and symbols 6-9 which are in the same shape as that of a hole frame are provided in the drilling process of through holes and guide holes of inner-layer substrates 1-5 and in a wiring formation process, respectively. A proper layer configuration can be judged by combining the inner-layer substrates l-5 so that all of the symbols 6-9 of the inner-layer substrates 2-5 can be seen from holes 1a-1d of the inner-layer substrate 1 at the upper part. |
