| 摘要 |
<p>PURPOSE:To provide a method for manufacturing a semiconductor package by which a low-cost and high-reliability semiconductor mounting circuit device can be formed with a good yield and to provide a method for mounting a semiconductor, and to provide a semiconductor mounting device which is suitable for the method for mounting a semiconductor. CONSTITUTION:This method includes a process wherein on a pressure stage, a semiconductor chip 8 having bump electrodes is arranged and mounted on a circuit board 7 having a wiring circuit including a terminal face 7a for connection, with bumps 8a of the semiconductor chip 8 being aligned to the terminal face 7a of the circuit board 7, and a pressurization process wherein the arranged and mounted semiconductor chip 8 is pressurized and the bump electrodes on the bumps 8a of the semiconductor chip 8 are brought into contact with the terminal face 7a. It also includes a clamping process wherein the pressurized condition of the chip 8 against the substrate 7 is maintained, a process wherein the chip 8 clamped on the substrate 7 is moved from the pressure stage to a stage on which resin is filled and then to a stage where the resin between the substrate 7 and the chip 8 is cured and the resin for sealing is cured, and a process wherein clamping is canceled for maintaining the pressurized condition of the chip.</p> |
