| 摘要 |
PURPOSE: To provide a microelectronic component for functioning particularly at the ambient temperature by manufacturing it by scaling and lithography. CONSTITUTION: A board 10 having a main surface 1 is provided. A layer structure 13, including individual elements 14 aligned and disposed in one layer, is disposed on the surface 1 of the board 10. At least two contact structures 12 which are electrically connected to the structure 13 are provided on the surface 11 of the board 10. The elements 14 and structures 12 are electrically insulated from the board 10, and the elements are electrically connected above and below via a quantum-mechanical contact. |
