| 摘要 |
<p>PURPOSE:To obtain an adhesive having high reliability of high reflow cracking resistance and useful in semiconductor devices by using a reaction product between an acrylonitrile-polybutadiene copolymer and an epoxy resin, a curing agent, an organic compound and a free radical polymerization initiator. CONSTITUTION:This adhesive comprises (A) a reaction product from (i) an acrylonitrile-butadiene copolymer bearing carboxylic groups on the chain terminals and (ii) an epoxy resin bearing 2 or more epoxy groups (for example, an epoxy resin derived from bisphenol-A or bisphenol-F and epichlorohydrin) (B) a curing agent, (C) a (meth)acryl group-having organic compound and (D) a free radical polymerization initiator, preferably further (E) a filler preferably silver dust. The component (A) is prepared by allowing the component (i) to react with the component (ii) at a weight ration of 10/90 to 90/10 at 80 to 120 deg.C for 30 minutes to some 6 hours.</p> |
