发明名称 Multilayer buffer structure including II-VI compounds on a silicon substrate
摘要 A layer (32) of a HgCdTe compound epitaxially contacts a buffer structure, which in turn epitaxially contacts a silicon substrate (22). The buffer structure is formed of II-VI compounds, and preferably includes at least one layer (24) of a ZnSeTe compound epitaxially contacting the silicon substrate (22) and a layer (30) of a CdZnTe compound overlying the ZnSeTe compound layer (24). The ZnSeTe compound layer (24) may be provided as a single graded layer having a composition of ZnSe adjacent to the silicon and a composition of ZnTe remote from the silicon, or as two distinct sublayers with a ZnSe sublayer (26) adjacent to the silicon substrate (22) and a ZnTe sublayer (28) remote from the silicon substrate (22).
申请公布号 US5449927(A) 申请公布日期 1995.09.12
申请号 US19940245147 申请日期 1994.05.16
申请人 SANTA BARBARA RESEARCH CENTER 发明人 HAMILTON, JR., WILLIAM J.;JOHNSON, SCOTT M.;AHLGREN, WILLIAM L.
分类号 H01L21/20;H01L21/205;H01L21/36;H01L29/225;H01L29/267;H01L31/0264;(IPC1-7):H01L29/161 主分类号 H01L21/20
代理机构 代理人
主权项
地址
您可能感兴趣的专利